Register to unlock your exclusive B2B prices and start shopping. Sign up now!
Mounting Plate
Order only
EAN: 4011377275959
MPN: 54-2GFP
Box: 1
Price (excl. VAT)
5,91 €
per unit
MOQ: 1
EDT to our warehouse: 2-4 weeks
Price valid until 31.12.26 or while in stock
Technical Information
| Item condition | New |
| Manufacture name | Mounting plate 54-2GFP |
| Brand | Jung |
| Categories |
Ethernet Wall Plates
|
| Country of origin* | DE |
| * The actual country of origin may differ depending on the delivery batch. To confirm the specific country of origin, please contact your account manager. | |
| Harmonized System Code | 8538 9099 00 |
| ETIM | EC000018 |
| Mounting method | Surface mounted (plaster) |
| Assembly arrangement | Other |
| Utilization | Modular Jack |
| Outlet direction | Straight |
| Suitable for number of connectors | 2 |
| Shielded buses | No |
Packing details
| Packing level 1 | 4011377275959 |
| Packing level 2 | 4011377275959 |
Other Technical data
| Halogen free | Yes |
| With hinged lid | No |
| Surface protection | Other |
| With strain relief | No |
| Material quality | Thermoplastic |
| Imprintable label | Without indication field |
| Material | Plastic |
| Type of fastening | Clamp mounting |
| Shielded housing | No |
| Luster terminal | No |
| RAL-number (similar) | 0 |
| With dust cover | No |
| With imprint | No |
| With buses/couplings | No |
| Support ring | No |
| Transparent | No |
| Surface finishing | Glossy |
| Device width | 67 mm |
| Device height | 67 mm |
| Device depth | 0 mm |
| Number of modules (module system) | 0 |
| Min. depth of built-in installation box | 0 mm |
Downloads
Description
Mounting plate designed for modular socket applications in surface-mounted systems.Integrates seamlessly into power or switch setups, ensuring secure placement and compatibility with standard connector arrangements.;Glossy plastic construction using thermoplastic material quality.Dimensions:67mm width x 67mm height x unspecified depth.Assembly arrangement listed as "Other". Clamp mounting fastening method utilized;halogen-free composition improves safety standards.Modular Jack utilization supports up to two connectors with straight outlet direction;no hinged lid, dust cover, or imprintable label present in design features.Transparent property excluded from build characteristics;surface protection classified under "Other" specification directive without anti-bacterial treatment applied to final form output.Lacks shielding configuration both in buses and housing assembly points while omitting strain relief within structural inclusion lists—device depth not defined numerically beyond external reference set limits