Technical Information
| Item condition |
New |
| Manufacture name |
Centre plate for MJ f. 2 sockets A1569-25WECH |
| Brand |
Jung
|
| Categories |
Ethernet Wall Plates
|
| Country of origin* |
DE |
|
* The actual country of origin may differ depending on the delivery batch.
To confirm the specific country of origin, please contact your account manager.
|
| Harmonized System Code |
8538 9099 00
|
| ETIM |
EC000018
|
| Mounting method |
Surface mounted (plaster) |
| Assembly arrangement |
Other |
| Utilization |
Modular Jack |
| Outlet direction |
Straight |
| Suitable for number of connectors |
2 |
| Shielded buses |
No |
| Suitable for degree of protection (IP) |
IP20 |
Packing details
| Packing level 1 |
4011377177611 |
| Packing level 2 |
4011377177611 |
Other Technical data
| Colour |
Other |
| Halogen free |
Yes |
| With hinged lid |
No |
| Surface protection |
Lacquered |
| With strain relief |
No |
| Material quality |
Thermoplastic |
| Imprintable label |
Without indication field |
| Material |
Plastic |
| Type of fastening |
Clamp mounting |
| Shielded housing |
No |
| Luster terminal |
No |
| RAL-number (similar) |
0 |
| With dust cover |
No |
| With imprint |
No |
| With buses/couplings |
No |
| Support ring |
Yes |
| Transparent |
No |
| Surface finishing |
Matt |
| Device width |
55 mm |
| Device height |
55 mm |
| Device depth |
0 mm |
| Number of modules (module system) |
0 |
| Min. depth of built-in installation box |
0 mm |
Downloads
Description
Centre plate designed for Modular Jack applications, accommodating up to 2 connectors.Component integration in power or data systems requiring surface-mounted configuration. Material:Plastic, thermoplastic.Halogen-free.Surface protected with lacquered finish, matt texture.Colour classified as "Other".Mounting method:Surface mounted (plaster).Fastening type:Clamp mounting.Dimensions - Width:55 mm;Height:55 mm;Depth unavailable (0 mm reading).Assembly arrangement listed as "Other".Outlet direction marked straight.Degree of protection rated IP20.Support ring included for installation adjustments or mechanical support measures during assembly process without strain relief features present internally within the structure layering impacts suitability structured modular overall focused infrastructure designs avoids alternative configurations disconnect redundancy simplified allocations ‘兩socket-linked indivisible-phase multiple high(TBC-->writer end forced adjustments)%"